Rong Jiang, C. C. Chen
Jun 6, 2004
2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)
With the advancement of radio frequency mixed signal ICs, lossy silicon substrate has significant impact on the already complicated interconnect niodeling issue. To account for the substrate loss, the traditional electromagnetic methods are often computationally prohibitive for large scale systems.