This study investigates the effects of different averaging volumes, reference temperatures, and intermetallic compound thickness on the fatigue life prediction of Sn-3.8Ag-0.7Cu lead-free solder joints in plastic ball grid array packages.

Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

Voids in BGA solder balls significantly impact the thermal fatigue reliability of solder joints, with a linear correlation between void content and fatigue life.

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

This paper presents 3D FEA fatigue models for TFBGA on board, enabling accurate prediction of solder joint reliability during thermal cycling tests within 13% error.

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

The IMC layer reduces the fatigue life of Sn–3.8Ag–0.7Cu solder joints, with thicker layers resulting in a lower fatigue life.

Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

The new solder joint fatigue model based on FEA simulations and reliability data can accurately predict temperature cycling test requirements for ball grid array (BGA) packages.

A preliminary solder joint life prediction model by experiment and simulation for translation of use condition to temperature cycling test condition

The 3D FEA model effectively predicts the fatigue life of solder joints in LFBGA and TFBGA packages, aiding in design guidance and optimizing package configuration.

Board level solder joint reliability modeling of LFBGA package

Sn10Pb90 high lead solder ball reduces substrate stress and improves thermal fatigue life in HTCC packaging, while metal frame structures add weight, causing high internal thermal strain and low thermal fatigue life.

Simulation and Thermal Fatigue Analysis for Board Level BGA Connection of HTCC Packaging

Long dwell times in microelectronic solder joints do not significantly increase their fatigue strength, but creep behavior during dwell times is crucial for estimating their fatigue life.

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading

The study presents a finite element method for predicting thermal fatigue life of solder joints in plastic ball grid array packages using a unified, viscoplastic constitutive model and ABAQUS software.

Thermal fatigue life prediction of solder joints of plastic ball grid array packages

The new peel stress-based correlation improves solder joint reliability prediction in FCBGA packages by incorporating both average peel stress and plastic work density increment, resulting in higher coefficient of determination and better accuracy.

An improved peel stress-based correlation to predict solder joint reliability of lidded flip chip ball grid array packages

The outermost ring elements averaging method provides better results for predicting the fatigue life of Sn-3.8Ag-0.7Cu solder joints in PBGA components compared to traditional whole interface layer elements averaged method.

Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints

The study improves the accuracy of thermal fatigue life prediction for solder joints in plastic ball grid array packages using a unified, viscoplastic constitutive model and ABAQUS software.

Effects of microstructure on thermal fatigue life prediction of solder joints

Different solder alloy compositions in BGA solder joints have different thermal fatigue lives, affecting preventive maintenance advice for mission-critical systems.

Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions

The choice of creep law significantly affects the results for PBGA solder balls, but not for ceramic chip resistors or FR-4 board components.

Thermal fatigue modelling for SnAgCu and SnPb solder joints

This study used FEA modeling and nanoindentation technique to predict the stress-strain behavior of thermally cycled SAC305 solder joints and identify critical failure locations under shear loading in PBGA packages.

Prediction of Stress-Strain Behavior of Thermally Cycled SAC305 Solder Joints by Finite Element Modeling and Nanoindentation Characterization

Different FEA approaches for Plastic Ball Grid Array assemblies can improve simulation accuracy and efficiency, aiding in reliability predictions.

Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies

The finite element model accurately predicts thermal fatigue life and damage mechanisms in ceramic ball grid array packages, with a preferred failure site in and around the Pb37-Sn63 solder attachment.

Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package

This study developed a simple analysis method to estimate the thermal fatigue life of CBGA solder joints in electronic package assemblies, using elastic material properties except for the solder materials.

CBGA solder joint thermal fatigue life estimation by a simple method

This study successfully investigates rapid thermal fatigue behavior of single SnAgCu solder joints using electromagnetic induction heating, improving the reliability of electronic packaging devices.

Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint

Sn-3.5 mass%Ag with 50 degree ball shape geometry has the longest thermal fatigue life in low cycle fatigue for lead-free BGA solder joints.

Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

solder ball joint fatigue thermal fluid FEA analysis

These studies suggest that finite element analysis (FEA) models, including 3D FEA and viscoplastic constitutive models, are effective in predicting the thermal fatigue life of solder joints in various ball grid array (BGA) packages, with factors such as void content, intermetallic compound thickness, and dwell times influencing fatigue life.