D. Hui
2008
Citations
0
Influential Citations
2
Citations
Journal
Plating and Finishing
Abstract
Cupron spectrophotometry determining copper with EDTA-Cit-NH4OH mixed solution to screen interference ions and directly determining copper in aqueous solution was introduced.This method can be used in electroplating analysis in following aspects: analysis of copper in electroplating waste water,analysis of copper impurity in various electroplating bath,analysis of copper in alloy coatings and alloy plating baths etc.Principle,analytical operation and calculation of this method were also introduced in detail.