Mikio Kajiyama
2002
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Abstract
This chapter presents the chemistry of bis-maleimides used in adhesives. In a narrow sense, “bis-maleimide resin” means the thermosetting resin composed of the bis-maleimide of methylene dianiline (BMI, bis (4-maleimidophenyl)methane) and methylene dianiline (MDA, bis (4-aminophenyl)methane). Because of the addition mechanism, the resin is cured without elimination, which is a characteristic of this resin. Bis-maleimide resin is used as a thermally stable matrix up to 204°C (400°F) where typical epoxy resins may not normally be used. BMI was also used as a cross-linking agent for polyiminoethylene. The Michael addition takes place with the nucleophilic nitrogen of the imino group and the double bonds of the electrophilic BMI. The Michael addition of BMI is now adopted as a cross-linking reaction for polymers with amino end groups. Maleimides have three principal reaction pathways: radical addition to vinyl compounds, the Michael addition with compounds having active hydrogens, and the Diels-Alder reaction with dienes. Any of the three can be a tool for forming thermosetting adhesives. Introduction of acetylene derivatives at the end of the oligomer gives reactive bis-acetylene terminated oligomers. Three acetylene end groups react together to form an aromatic cross-linking point. The advantage of this system is the aliphatic free curing system.