W. Zeng-lin
2012
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Journal
Plating and Finishing
Abstract
Using an ionic liquid namely 1-ethyl-3-methyl imidazolium fluoroboric acid as solvent in electroless copper plating,effects of the ionic liquid to the electroless copper plating were studied.Results showed that copper deposition rate was decreased,crystal grain was refined and resistance was increased with increase of the 1-ethyl-3-methyl imidazolium fluoroboric acid concentration.Also it was found that the deposited Cu film was uniform and nucleus formation of the Cu(111)was enhanced with the addition of 1-ethyl-3-methyl imidazolium fluoroboric acid by SEM and XRD.Electrochemical measurement indicated that anodic peak potential shifted negatively and oxidation peak current density decreased with increase of the 1-ethyl-3-methyl imidazolium fluoroboric acid concentration,which showed inhibition function of the 1-ethyl-3-methyl imidazolium fluoroboric acid to electroless copper deposition rate.