Chen Guo-liang
2013
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Journal
Journal of Zhangzhou Normal University
Abstract
The influence of N-Methylthiourea(MTU)on the anodic dissolution and cathodic deposition of Cu in acid sulphate plating bath was studied by cyclic voltammetry and electrochemical quartz crystal microbalance(EQCM).The effect of coexisted MTU and Cl-on the corrosion resistance of copper deposition was investigated by Tafel equation.The results showed that N-Methylthiourea can change the mechanism of the anodic dissolution and cathodic deposition,produce the Cu+ ions.When Cl-is 70 mg/L,the corrosion resistance of copper deposition is the best.