Maksudul Hasan, J. Rohan
May 1, 2010
Citations
1
Influential Citations
45
Citations
Journal
Journal of The Electrochemical Society
Abstract
Methanesulphonic acid (MSA) is an alternative to sulphuric acid electrolyte for metal deposition. The electrochemical nucleation and growth of Cu on a glassy carbon (GC) electrode in the methanesulphonate was compared with sulphate baths. The overpotential for Cu deposition was much smaller in the MSA bath compared to the traditional sulphuric acid bath and Cu nucleation occurred at a higher rate in the MSA bath. The measured diffusion coefficient value for Cu deposition from the MSA bath was 6.82 x 10 6 cm 2 /s. UV-Vis spectroscopic results confirmed that the coordination of Cu species was the same in both electrolytes. Cu electrodeposition on Ni sputtered Si substrate from the high efficiency MSA bath was found to be photoresist compatible with no void formation. 1D Cu nanorods were also deposited through AAO template on a Ni evaporated seed layer substrate showing potential applications as electrical interconnects in ULSI and MEMS.